Delivering on its promise to innovate best-in-class technologies to the M2M marketplace, Gemalto introduced Land Grid Array (LGA) surface mounting technology in 2010 and it has since become the industry's gold standard. LGA technology provides the most reliable and flexible surface mounting technology for soldering wireless modules into integrated solutions. LGA modules feature an optimized circuit footprint and pad size with a versatile geometrical layout that allows customer choice of soldering paste, different grades of overprinting and precise soldering results.
Optimized Footprint with geometric pad layout
Special geometric pad layout without pads in the middle and near to the corners of the module eliminates negative warpage effects during reflow processing.
NiAu surface eliminates passivation problems during storing and soldering and improves conductivity and performance of the module.
Minimized impact on antenna path
Ground pads underneath the RF components minimize the impact on antenna path.
Customer specific overprinting
Pad size and level pitch enable customer specific overprinting for excellent yield rate and optimal performance.
Comparison LGA vs BGA
Gemalto's intense research and testing revealed the specific advantages of LGA over BGA surface mount technology. Although both offer automatic pick and place capability, automatic soldering and easy handling, LGA technology provides increases flexibility and cost efficiencies that are ideal for M2M solution manufacturing and mass production.
Heat must be applied to fix balls of solder onto the module. Soldering paste must be applied with extreme precision to fit balls of solder that are already fixed on the module. Due to the temperature profile of the already fixed solder, customer choice of soldering paste is limited.
Blank NiAu pads are engineered on the surface of the module. A wide range of soldering pastes may be used so that solder material selection is based on customer needs and processes. Blank pads offer high flexibility for customer specific soldering paste.
Heat must be applied to fix balls of solder onto the module. BGA ball height differs by up to 50%, reducing coplanarity and functionality. An additional heating is necessary to place the balls to the modules´ ground during manufacturing of the modules.
A unique layout of LGA pads provides optimized heat dissipation. Connections would be critical near to the corners and in the middle. NiAu pads prevent surface corrosion. Limited PCB warpage impacts on soldering joints.
Residues of flux lead to passivation, or reduced conductivity of the balls. Residues of flux on module ball surfaces can reduce the yield rate impending performance of the module.
Optimized pad size enables customer specific overprinting for excellent yield rate. Flat design optimizes customer application. Pad layout contributes to mimized impact on RF part. Ground pads are located underneath the RF components.