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EHS5-E 3G Europe

Highly Efficient 3G Connectivity in a 2G Footprint

EHS5 delivers highly efficient 3G connectivity in an ultra-compact footprint featuring high-speed data communication with 7.2 Mbps (max) in the downlink and 5.76 Mbps (max) in the uplink.  It is ideal for M2M applications moving to 3G technology with a focus on long-lasting, future proof and cost-efficient M2M applications. Offering a backward and forward compatible footprint, its multi-design capability offers seamless migration and unmatched flexibility to choose frequency bands and global roaming whenever needed.

The module incorporates an improved Java concept using Multi MIDlet Java execution to simultaneously host and run multiple applications and protocols. An extended security concept with the latest TLS/SSL engine provides secure and reliable TCP/IP connectivity while an enriched internal flash file system enables royalty-free firmware updates over-the-air (FOTA) when required. Sophisticated sandbox modelling and layered architectures simplify development allowing simultaneous progress of both devices and software applications for a shorter time to market.

The tiny module's LGA (Land Grid Array) package is perfectly suited to the process manufacturing needs of high-volume M2M devices with a focus on reliable and efficient processes. EHS5 is available in two variants: EHS5-US (850/1900 MHz) for North America and EHS5-E (900/2100 MHz) for the rest of the world.

The EHS5-E wireless module features:

Frequency BandsDual Band 3G, Dual Band 2G
CertificationsGCF, RED
Dimensions / Mounting
27.6 x 18.8 x 2.3mm
Special Features​Best in class low power consumption
Max. Data Rate (UL/DL)  7.2/5.7 Mbps
Embedded ProcessingJava
Voice SupportCircuit Switched
Serial InterfacesI2C SPI
Other InterfacesGPIO
AudioDigital (I2S, PCM)