EHS5

Highly Efficient 3G Connectivity in a 2G Footprint


EHS5 delivers highly efficient 3G connectivity in an ultra-compact footprint featuring high speed data communication with 7.2 Mbps (max) in the downlink and 5.76 Mbps (max) in the uplink.  It is ideal for M2M applications moving to 3G technology with a focus on long-lasting, future proof and cost efficient M2M applications. Offering a backward and forward compatible footp​rint, its multi design capability offers seamless migration and unmatched flexibility to choose frequency bands and global roaming whenever needed.

The module incorporates an improved Java concept using Multi MIDlet Java execution to simultaneously host and run multiple applications and protocols. An extended security concept with the latest TLS/SSL engine provides secure and reliable TCP/IP connectivity while an enriched internal flash file system enables royalty free firmware updates over-the-air (FOTA) when required. Sophisticated sandbox modeling and layered architectures simplify development allowing simultaneous progress of both devices and software applications for a shorter time to market.

The tiny module's LGA (Land Grid Array) package is perfectly suited to the process manufacturing needs of high-volume M2M devices with a focus on reliable and efficient processes.  EHS5 is available in two variants: EHS5-US (850/1900 MHz) for North America, and EHS5-E (900/2100 MHz) for the rest of the world.

The EHS5 wireless module features:

  • Region: Emea, Apac, Noram
  • GPRS/EDGE Class 12
  • Java™ profile IMP-NG & CLDC 1.1 HI
  • HSPA
  • Dual-Band
  • USB 2.0
  • Extended operating temperature range: -40° to +85°C
  • Best in class low power consumption
  • Industrial serial interfaces including USB

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